Advanced Convergence Semiconductors Innovation LAB
차세대 반도체소자 융합연구실
(Motivation Driven Research, Smart and Funny )



Park group’s research interests are classified into Innovative Semiconductor Devices & various Applications such as Perovskite-hybrid memory devices, ECRAM, SOM, STT MRAM, Mem-transistor, beyond CMOS, Sensors and Energy harvesting devices using the low dimensional compound semiconductors. In terms of semiconductor fabrication process, we are interested Vertical structured (3D) ReRAM, STT MRAM, etc using ALD process. Our goal is to replace with classical semiconductor materials and devices by advanced semiconductor material system and structures.
1. Advanced Emerging Memory Devices: Currently we are mainly conducting research related to
the ReRAM using the metal oxide or Perovskite materials, STT MRAM, SOM, FRAM
- Improve Multilevel application of metal oxide nanostructures
- Perovskite nanostructure based Memristors
- Metal Oxide / Perovskite structures for memory devices and others
Keyword : AI Semiconductors, Perovskites, ReRAM, SOM, STT MRAM, MEM Transistor, Optical Synapse
2.Energy Harvesting : Development of techniques for renewable energy harvesting by using
the nano-generator and TENG, etc.
- Flexible TENG, PENG, Solar Cells
- Self-powered sensor and displays with harvesting techniques.
Keyword : Flexible Devices, Self-powered, Piezo/Tribo Electronic Devices
3. Optical Sensors: Developing new materials and structures for the photodetectors
- Cover from UV to IR ranges : perovskite and others
- Flexible sensors using tranfer method of metal oxide nanomaterials
- Phtocatalyst for Environmental issues by using nanotechnology
Keyword : Metal Oxide Spheres, Perovskite, Quality control, Visible and IR
4. Thermal Management: Thermal interafce materials and Applications to Semiconductors
- Flexible hybrid devices(solar cell, perovskite, etc) and electronic devices (FET, Memory, etc)
- MO ML-based transfer techniques for novel device performance
- Thermal management by using transferable MO monolayer.
Keyword : Thermal Interface Material (TIM), Micro/nano spheres, Thermal conductivity, PKG
5. SC Fabrication process : 3D Memory devices, Vertical SOM, Cross-points.
- Semiconductor Fabrication process for 3D device performances
- TCAD simulation
- ALD Process : Process design and presursors
Keyword : Vertical SOM, ALD , DFT, TCAD simulations,